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长鑫“毕业”了 市值3.3 万亿!但国产存储刚进入最难的阶段

王梓璇 2026-07-28 11:54
王梓璇 2026/07/28 11:54

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本文核心分享了长鑫科技上市的关键信息以及国产存储产业的现状判断,核心干货如下:

1. 核心事件:长鑫科技正式登陆科创板,首发募资579亿元创下科创板纪录,开盘价较发行价上涨471%,市值突破3.3万亿元成为A股市值第一,打新中一签盈利超2万元;长鑫上市前累计一级市场融资超660亿元,加上IPO募资总融资额达1240.85亿元,稳居国产存储赛道融资第一。

2. 核心判断:长鑫上市代表国产存储完成了从0到1的突破,但接下来才进入最难的阶段,任务从造出单颗存储芯片转变为打造完整自主的国产存储产业链。

3. 行业动向:国家大基金已经不再追加投资长鑫,转而将资本投向存储上游的材料、设备环节,补齐产业短板。

本文为存储领域相关品牌商梳理了赛道格局和未来发展机会,核心干货如下:

1. 赛道格局:当前国产存储赛道资本集中度极高,长鑫一家就吸纳了一级市场近七成的融资金额,符合DRAM产业天然的寡头竞争规律,未来国产存储赛道头部集中的趋势会持续强化。

2. 消费与产业趋势:国产存储已经完成从0到1的国产替代初步突破,消费者对国产存储的接受度持续提升,主打国产自主可控的品牌定位会更契合当前国内消费趋势。

3. 合作机会:长鑫作为未来的产业链链主,会逐步开放供应链带动上下游发展,下游存储成品品牌可以深化和长鑫等本土龙头的合作,绑定国产供应链获得品牌和成本优势,抓住国产替代的增长风口。

本文为存储领域相关卖家梳理了行业变化、机会和风险提示,核心干货如下:

1. 行业与政策变化:国产存储已经走完举国体制孵化单一龙头的阶段,进入龙头带动全产业链生态发展的新周期,国家大基金战略重心转移,政策和资本红利明显向存储上游材料、设备环节倾斜。

2. 机会提示:当前国内市场国产替代认知度快速提升,消费者对国产存储的需求持续增长,卖家可以主打国产自主的产品标签,依托长鑫的本土龙头供应链优势获取用户信任,拓展市场份额。

3. 风险提示:当前国产存储产业链上游核心设备、材料仍依赖进口,供应链稳定性存在不确定性,卖家需要提前布局供应链风险应对,同时在头部集中的行业格局下,中小卖家要错位竞争,避免盲目对标头部打价格战。

本文为存储产业链相关工厂梳理了产业需求、商业机会和发展方向,核心干货如下:

1. 生产需求变化:长鑫已经发展成熟,接下来产业发展的核心任务是完善上游配套产业链,存储上游的大硅片、高纯靶材、检测设备、封测等环节的生产需求会大幅增长,相关工厂可以对接龙头供应链获得稳定订单。

2. 进入启示:存储芯片制造本身是重资产的寡头赛道,单条产线投资动辄百亿美元,行业门槛极高,新工厂不要盲目投入存储芯片制造环节,应该聚焦龙头需要的细分配套环节深耕。

3. 方向指引:当前国家大基金明确将投资重心转向存储上游短板环节,相关领域的生产工厂可以争取政策和资本支持,加大技术研发升级,契合产业发展方向,获得更多增长空间。

本文为半导体存储领域的服务商梳理了行业趋势、客户痛点和发展机会,核心干货如下:

1. 行业发展趋势:国产存储产业已经进入结构化升级的新阶段,产业发展重心从打造龙头存储芯片企业,转向补齐上游材料设备短板、完善全产业链生态,上游环节的服务需求会迎来快速增长。

2. 核心客户痛点:当前国产存储产业链的核心矛盾已经从造不出存储芯片,转变成造不出造芯片的设备和材料,上游细分环节的中小企业普遍存在缺资本、缺技术对接、缺订单渠道的痛点,龙头企业也有对接本土配套供应商的需求,需要专业服务商搭建对接桥梁。

3. 业务机会:当前资本和政策都向上游配套环节倾斜,服务商可以围绕上游材料设备企业的需求,布局投融资对接、技术转化、供应链匹配等业务,抓住产业升级带来的增量机会。

本文为半导体产业相关平台商梳理了行业需求、发展方向和风险规避要点,核心干货如下:

1. 行业新需求:国产存储进入产业链生态建设新阶段,龙头企业有开放产能、对接本土配套供应商的需求,上游中小配套企业有对接资本、订单、技术的需求,产业平台需要承担起对接龙头和上下游配套企业的作用,完善产业生态服务。

2. 招商和运营方向:未来平台招商和资源倾斜可以重点放在上游材料、设备、检测等短板环节,这些领域是当前资本和政策布局的核心方向,符合产业发展趋势,也更容易获得政策支持。

3. 风向规避:存储芯片制造环节已经形成高度集中的头部格局,新的大规模制造项目空间很小,平台不要盲目引入存储制造项目浪费资源,应该顺应产业规律,聚焦产业链配套环节的服务和招商,契合当前产业发展节奏。

本文为半导体存储产业研究者提供了最新的产业结构变化和研究方向参考,核心干货如下:

1. 产业新动向:长鑫上市标志着国产存储产业完成第一阶段发展目标,成功打造出符合产业规律、能参与全球竞争的本土龙头,产业正式进入新周期,从举国体制孵化单一龙头转向龙头带动全产业链生态发展;国家大基金战略换场,从投资龙头转向投资上游短板,印证了产业结构升级的方向。

2. 待研究的新问题:当前产业核心矛盾已经从“能否造出自有存储芯片”转变为“能否实现全产业链自主可控”,核心卡脖子环节转移到上游设备材料领域,长鑫作为链主能否带动全产业链共同成长,是接下来值得长期追踪研究的核心命题。

3. 模式启示:国产存储第一阶段走的集中资源打造龙头的路径,符合DRAM产业寡头竞争的规律,验证了举国体制结合市场化融资模式的有效性,为其他卡脖子领域的产业发展提供了研究样本。

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Quick Summary

This article shares key updates on ChangXin Memory Technologies' (CXMT) IPO and an assessment of China's domestic memory chip industry. Key takeaways are as follows:

1. Core event: CXMT has officially listed on the Shanghai STAR Market, raising 57.9 billion yuan in its IPO—the largest amount ever on the STAR Market. Its opening price jumped 471% from the IPO offering price, pushing its market capitalization above 3.3 trillion yuan to make it the largest listed company on the A-share market by value. A single winning IPO lot generated over 20,000 yuan in profit for retail investors. Prior to its listing, CXMT had raised more than 66 billion yuan in private funding; combined with its IPO proceeds, total financing reaches 124.085 billion yuan, making it the best-funded company in China's domestic memory chip track.

2. Core assessment: CXMT's IPO marks that China's domestic memory industry has completed its "from 0 to 1" breakthrough. However, the most challenging phase lies ahead: the industry's task is shifting from producing individual memory chips to building a complete, independent domestic memory chip supply chain.

3. Industry shift: China's National Integrated Circuit Industry Investment Fund (National Big Fund) has stopped additional investment in CXMT, and is now redirecting capital to upstream material and equipment segments to shore up the industry's weak links.

This article outlines industry landscape and future growth opportunities for memory-focused brands. Key insights are as follows:

1. Industry landscape: China's domestic memory sector is extremely capital-concentrated, with CXMT alone accounting for nearly 70% of all private financing raised in the track. This aligns with the natural oligopolistic competition pattern of the DRAM industry, and the trend of increasing concentration in the domestic memory sector will continue to strengthen.

2. Consumer and industry trends: Domestic memory has achieved an initial "from 0 to 1" import substitution breakthrough, and consumer acceptance of Chinese-made memory continues to rise. A brand positioning centered on domestic independence and control will be well-aligned with current domestic consumer trends.

3. Collaboration opportunities: As the future anchor of the industry chain, CXMT will gradually open up its supply chain to drive growth for upstream and downstream players. Downstream finished memory brands can deepen cooperation with domestic leaders like CXMT, lock in advantages in brand positioning and costs by partnering with domestic supply chains, and capitalize on the growth momentum from import substitution.

This article summarizes industry shifts, opportunities and risk warnings for memory product sellers. Key takeaways are as follows:

1. Industry and policy shifts: China's domestic memory industry has finished the state-backed incubation phase for a single leading player, and entered a new cycle where the leading firm drives growth of the full industrial ecosystem. The National Big Fund has shifted its strategic focus, and policy and capital dividends are clearly tilted toward upstream memory materials and equipment.

2. Opportunity outlook: Public awareness of domestic substitution is rising rapidly in the Chinese market, and consumer demand for domestic memory is growing steadily. Sellers can leverage a "domestic and independent" product positioning, build consumer trust by relying on CXMT's leading domestic supply chain, and expand market share.

3. Risk warnings: Core upstream equipment and materials for the domestic memory industry still rely on imports, leaving supply chain stability uncertain. Sellers should prepare contingency plans for supply chain risks in advance. In a highly concentrated industry landscape, small and medium-sized sellers should pursue differentiated competition instead of blindly engaging in price wars with leading players.

This article outlines industrial demand, business opportunities and development directions for factories across the memory supply chain. Key insights are as follows:

1. Shifting production demand: CXMT has reached maturity, and the core task of industry development is now to improve upstream supporting supply chains. Production demand will grow sharply for upstream segments including large silicon wafers, high-purity sputtering targets, testing equipment and packaging & testing. Relevant factories can secure stable orders by integrating into the leading firm's supply chain.

2. Entry guidance: Memory chip manufacturing itself is a capital-intensive oligopolistic track, with a single production line often requiring tens of billions of dollars in investment and extremely high entry barriers. New factories should not blindly invest in memory chip manufacturing; instead, they should focus on deepening expertise in niche supporting segments demanded by industry leaders.

3. Strategic guidance: The National Big Fund has clearly shifted its investment focus to weak upstream links in the memory sector. Production factories in these areas can pursue policy and capital support, scale up R&D and technical upgrades to align with industry development trends, and unlock greater growth space.

This article outlines industry trends, client pain points and growth opportunities for service providers in the semiconductor memory sector. Key takeaways are as follows:

1. Industry development trend: China's domestic memory industry has entered a new stage of structural upgrading, with its focus shifting from building a leading memory chip firm to shoring up weaknesses in upstream materials and equipment and improving the full industrial ecosystem. Demand for services targeting upstream segments will see rapid growth.

2. Core client pain points: The core bottleneck of the domestic memory industry has shifted from an inability to produce memory chips to an inability to produce the equipment and materials needed to make memory chips. Small and medium-sized enterprises in niche upstream segments generally face pain points including lack of capital, limited access to technical partnerships, and few channels for securing orders. Meanwhile, leading firms also need to connect with domestic supporting suppliers, creating demand for professional service providers to build connection bridges.

3. Business opportunities: With both capital and policy tilted toward upstream supporting segments, service providers can develop offerings around the needs of upstream material and equipment companies, including investment and financing matching, technology commercialization, and supply chain matching, to capture incremental opportunities brought by industrial upgrading.

This article outlines industry demand, development directions and risk mitigation for semiconductor industry platform operators. Key insights are as follows:

1. New industry demand: As domestic memory enters a new phase of industrial ecosystem building, leading firms need to open up production capacity and connect with domestic supporting suppliers, while small and medium-sized upstream supporting enterprises need access to capital, orders and technical partnerships. Industrial platforms need to take on the role of connecting leading firms with upstream and downstream supporting enterprises to improve the industrial ecosystem.

2. Recruitment and operation direction: Going forward, platforms can focus their recruitment and resource allocation on weak links including upstream materials, equipment and testing. These areas are the core focus of current capital and policy布局, align with industry development trends, and are more likely to secure policy support.

3. Risk mitigation: The memory chip manufacturing segment has already formed a highly concentrated market structure, with limited room for new large-scale manufacturing projects. Platforms should not blindly introduce memory manufacturing projects that waste resources; instead, they should follow industry patterns, focus on services and recruitment for supply chain supporting segments, and align with the current pace of industrial development.

This article provides an overview of the latest industrial structural changes and research direction references for researchers studying the semiconductor memory industry. Key insights are as follows:

1. New industry developments: CXMT's listing marks that China's domestic memory industry has completed its first-phase development goal, successfully cultivating a local leading player that complies with industry rules and can compete globally. The industry has officially entered a new cycle, shifting from state-backed incubation of a single leader to the leader driving growth of the full industrial ecosystem. The National Big Fund's strategic shift—from investing in leading firms to investing in upstream weak links—confirms the direction of industrial structural upgrading.

2. New research questions: The core industry bottleneck has shifted from "can China produce its own memory chips" to "can China achieve full industrial chain independence and control", with core choke points now moving to upstream equipment and materials. Whether CXMT as the industry chain leader can drive the common growth of the entire supply chain is a core topic that deserves long-term tracking and research going forward.

3. Model insights: The first phase of China's domestic memory development followed a path of concentrated resource allocation to build a leading player, which aligns with the oligopolistic competition rules of the DRAM industry. This path has validated the effectiveness of the model combining state-led institutional support with market-based financing, providing a research sample for industrial development in other choke point sectors.

Disclaimer: The "Quick Summary" content is entirely generated by AI. Please exercise discretion when interpreting the information. For issues or corrections, please email run@ebrun.com .

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作者丨王梓璇

编辑丨吴梅梅

来源 |IT桔子

今天上午九点半,上海证券交易所。一声锣响,长鑫科技 (688825) 正式登陆科创板。开盘价49.5元,较发行价上涨471%,市值突破3.3万亿元,一举登上A股市值榜首。

579亿元的首发募资额创下科创板纪录,中一签盈利超2万元,各家媒体弹窗都在推送同一个故事:科创板史上最大IPO、中国半导体自主可控的里程碑。

这些当然值得庆祝。

但在IT桔子数据库里查询了长鑫的七轮融资和全赛道数据后,我们发现了重要的结构性信号——它们藏在漂亮数字的背后,指向同一个判断:国产存储最艰难的阶段,不是从0到1,而是从1到产业链。

国产存储赛道的“单极格局”

在IT桔子的标签系统中,“存储器”赛道共收录了119家公司。我们拉取了它们2020年至今的融资数据(不含IPO):

过去六年间,整个存储器赛道在一级市场的融资总盘 (不含上市后定增等) 约为918.69亿元、174笔融资,分配给了大概75家创业公司。

其中,长鑫上市前在一级市场累计融资超过660亿元,也就是说长鑫一家就吸纳了全赛道接近七成的融资金额。

根据IT桔子统计,国产存储器赛道整个融资排名如下:

注:十家公司分为四类:

长鑫科技、长江存储、长鑫新桥属于存储芯片IDM(设计制造一体),自研自产DRAM或NAND Flash,重资产、建厂烧钱动辄百亿千亿;

华虹半导体属于晶圆代工,只帮别人制造芯片,不生产存储品牌产品;

澜起科技、兆易创新、北京君正、东芯股份属于芯片设计公司(Fabless),只设计不建厂,融资体量天然小得多;

江波龙、佰维存储属于模组/品牌厂商,从长鑫等买来芯片颗粒做成SSD、内存条成品销售。

如果把IPO募资也纳入统计, 在国产存储器赛道融资榜上,长鑫科技以1240.85亿元的总融资额稳居第一。若只聚焦于同为晶圆制造(IDM)龙头的企业——长江存储(NAND Flash赛道龙头,位列第四)融资96.20亿元,尚不足长鑫科技的十分之一;而长鑫新桥(位列第六)同样是合肥长鑫系的关联制造企业。

其余上榜公司(如兆易创新、江波龙等)多为芯片设计或模组厂商,融资体量与制造端不在同一量级。即便如此,在前十名所有竞争对手中,长鑫科技仍然保持着数量级的绝对领先。

这种集中度是否合理?

从产业规律看,集中是必然,也是必要。

DRAM产业从诞生之初就注定是寡头游戏。

三星、SK海力士、美光三家占据全球逾95%的市场份额,一条先进制程产线的投资动辄百亿美元级别。

中国要想参与全球竞争,别无选择,必须集中一切可集中的资源,打造一个能与之抗衡的超级平台。从这个意义上说,长鑫今天的融资体量是产业规律的必然结果,而非资本分配不均的产物。

但也正因如此,拿到了全赛道绝大多数资源的长鑫,承担的“链主”责任也远超商业回报本身——长鑫的成功,不能只是长鑫一家的成功,而必须是整个国产存储产业链的成功。

长鑫如何在自身壮大的同时带动上游设备、材料、封测等配套环节共同成长,将是一个比市值涨跌更值得长期追踪的命题。

国家大基金接下来的动作,恰恰是对这个问题的回应。

大基金“换场”:从输血龙头到补齐短板

国家集成电路产业投资基金 (大基金) 在IT桔子数据库中共有127笔投资记录。2020年12月,大基金二期参与了长鑫156.5亿元的战略融资——这是它对单一存储标的最大的一笔手笔。

但在2020年12月那笔战略融资之后,大基金在长鑫的公开融资信息中再未作为新增投资方出现,包括今天的IPO也未减持现有股份。

“国家队不再追加投资”在直觉上可能被理解为负面信号。但当我们把镜头拉远,看到大基金这两年把弹药投放到了哪里,一个完全不同的叙事就会浮现:

大硅片、石英、靶材、检测设备、光学检测——全都是上游材料和设备环节。

大基金不再追加投资长鑫,不是不看好,恰恰相反——是因为长鑫已经“毕业”了,具备了独立融资和发展的能力。

国家队腾出手来,去解决更底层的瓶颈。

这个转变背后,是三层递进的积极信号:

第一层:长鑫自己能跑了。

账上有近600亿元IPO募集资金,年营收即将突破千亿,阿里、腾讯、社保基金等市场化机构争相接盘。一个不再需要国字号资本持续输血的企业,恰恰是“国产替代”战略最成功的答卷。

第二层:真正的瓶颈正在向上游转移。

EUV光刻机受限、12英寸大硅片依赖进口、高纯靶材被日系供应商垄断、高端检测设备受制于人——中国半导体产业的核心矛盾,正从“造不出芯片”转向“造不出造芯片的设备”。大基金的战略重心偏移,正是看到了这一趋势的主动调整。

第三层:产业叙事升级。

第一代叙事是“中国人要造出中国人自己的存储芯片”——长鑫做到了。

第二代叙事是“中国的存储芯片要跑在中国的硅片上、用中国的设备来造”——这才是大基金今天在推动的宏大目标。

长鑫的成功不是终点,而是一个更大故事的起点。

所以这是战略换场,长鑫拿走近七成资本去做产能追赶和技术爬坡,国家队去投它顾不上、也投不起的上游。

当大基金把弹药投向上游材料和设备,恰恰说明中国半导体产业正在进入更成熟、更结构化的新发展阶段。

最难的阶段,才刚刚开始

3.3万亿市值是资本市场给长鑫的成人礼。全网都在庆祝中国半导体终于有了自己的"万亿俱乐部"成员,这当然值得高兴。

但更值得书写的,是这组数据背后折射出的中国半导体产业正在经历的结构性变化:中国半导体产业已经走过了“举国体制孵化单一龙头”的阶段,正在迈入“龙头企业反哺产业链生态”的新周期。

长鑫不用再向任何人证明自己。但从“超级独角兽”到“产业链链主”,从被举国体制托举的龙头到能带动整条链的引擎——这条路,比从0到1难走几十倍。

国产存储的下半场,才刚刚开始。

注:文/王梓璇,文章来源:IT桔子(公众号ID:itjuzi521),本文为作者独立观点,不代表亿邦动力立场。

文章来源:IT桔子

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FAQ回顾

长鑫科技科创板上市后表现如何?

长鑫科技正式登陆科创板,开盘价49.5元,较发行价上涨471%,市值突破3.3万亿元,一举登上A股市值榜首,579亿元的首发募资额创下科创板纪录,中一签盈利超2万元。

当前国产存储赛道的融资分布有什么特点?

2020年至今国产存储赛道一级市场融资总盘约918.69亿元,长鑫一家就吸纳了全赛道接近七成的融资金额,总融资额达1240.85亿元稳居赛道第一,融资集中度高符合存储产业寡头竞争的规律。

国家集成电路大基金的投资重点有什么新调整?

大基金此前重点投资长鑫等存储龙头企业,目前已将投资重心转向大硅片、石英、靶材、检测设备等上游材料和设备环节,着力补齐半导体产业链底层短板,推动产业结构化升级。

国产存储产业接下来的核心发展目标是什么?

国产存储已度过从0到1孵化单一龙头的阶段,接下来将进入产业链建设攻坚期,重点推动长鑫等龙头企业发挥链主作用,带动上游设备、材料、封测等配套环节共同成长,实现全产业链自主可控。

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