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黄冈中学出来的博士 刚刚收获一个IPO

卜松 2026-06-18 19:35
卜松 2026/06/18 19:35

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本文核心是黄冈中学出身的芯片博士李梦雄创立的琻捷电子于6月17日登陆港交所IPO,开盘价31.6港币,市值近150亿,是国内成长最快的车规无线传感芯片企业。

1. 核心业务与行业地位:公司主营无线传感SoC,现有智能电芯芯片、智能轮胎芯片、智能通用传感芯片三条产品线,按2025年收入计,是全球第三大、中国第一大汽车无线传感SoC公司,BPS SoC细分赛道排名全球第一。

2. 创业成长干货:创始人李梦雄拥有十余年海外汽车芯片研发经验,看准汽车产业链向中国转移的趋势,放弃海外安稳工作回国创业,选对赛道提前布局,花近20个月攻破TPMS芯片技术,成功踩到国内强制安装政策红利,逐步成长为细分赛道龙头。

3. 未来增长方向:目前增长最快的智能电芯芯片,随着无线BMS市场爆发,未来成长空间广阔。

琻捷电子从0到1成为细分龙头的发展路径,对国内半导体品牌建设和产品发展有较强参考价值。

1. 产品研发:不盲目追行业热点,结合自身经验和政策预判选赛道,在TPMS还没有国内强制标准时就提前投入研发,在政策落地前完成量产认证,成功卡位赛道;后续逐步贴合新能源、储能产业发展趋势,拓展智能电芯芯片、通用传感芯片产品线,形成增长梯队。

2. 渠道建设:从创业初期就瞄准前装整车厂市场,目前已经覆盖国内前十汽车OEM,进入一级供应商和整车厂合作体系,依托技术优势获得产业资本背书,进一步打开品牌知名度和市场空间。

3. 品牌运营:长期保持高研发投入,近三年研发投入均超1亿元,研发人员占员工总数55%以上,毛利率从16.6%提升至28%,保持稳定增长,打造技术型品牌的核心竞争力。

琻捷电子的发展案例,给汽车芯片赛道相关从业者带来了明确的机会提示和经验参考。

1. 增长市场与机会:当前新能源汽车、储能、工业机器人等领域对无线传感芯片需求快速增长,其中无线BMS芯片的全球市场规模预计从2027年的1亿元增长至2030年的222亿元,增长速度极快,同时通用传感芯片还在向医疗器械、无人机、智能家电等领域拓展,存在大量市场机会。

2. 可学习经验:需要提前预判政策风向,抓住政策红利,琻捷在国内TPMS强制标准出台前4年就启动研发,提前完成认证,政策落地后快速占领市场;同时要依托产业资源发展,获得产业资本和下游客户的支持。

3. 风险提示:芯片赛道研发周期长、投入大,车规芯片认证周期长,创业初期容易遭遇融资难、研发受阻等问题,需要提前做好资金和团队储备,应对不确定性。

琻捷电子的发展,给国内汽车电子、半导体相关制造工厂带来了明确的需求方向和商业机会。

1. 产品生产与设计需求:车规芯片对生产制造的要求远高于消费级芯片,比如TPMS芯片需要承受-40℃-125℃的宽温差,还要承受轮胎高速旋转的离心力,要求极低功耗、极小封装,对生产工艺精度、可靠性测试能力都提出了极高要求,工厂需要匹配对应的技术能力才能进入车规芯片供应链。

2. 商业机会:随着国产车规无线传感芯片的快速发展,产品线已经从汽车拓展到大规模储能、商用重卡、工业机器人、医疗器械等多个领域,芯片订单量快速增长,上游制造工厂可以绑定头部国产芯片企业,获得长期稳定的订单。

3. 发展启示:国内汽车芯片国产替代浪潮已经到来,工厂需要加快技术升级,匹配车规芯片的生产要求,抓住产业链转移带来的增长机遇,提升自身市场份额。

琻捷电子的创业成长过程,反映了当前半导体创业领域的行业趋势和客户痛点,给相关服务商提供了发展方向参考。

1. 行业发展趋势:当前国内汽车芯片国产替代进程加速,大量有海外经验的技术人才回国创业,无线传感芯片等细分赛道的创业项目增长速度快,对配套创业服务的需求大量增加,尤其是具备产业资源和资本资源的服务缺口较大。

2. 核心客户痛点:半导体芯片创业项目普遍存在初期找资金、找团队、找资源难的问题,车规芯片研发认证周期长,投入大,在行业周期低谷期很容易出现资金断裂,同时创业团队缺乏对接下游整车厂、电池厂的渠道,难以打开前装市场。

3. 可探索的解决方案:服务商可以联合高校、产业资本打造垂直孵化体系,为初期创业项目提供研发场地、技术对接支持,同时提供持续的资本支持,在行业遇冷时为项目预留资金,还可以对接下游产业资源,帮助项目快速导入客户,提升创业成功率。

琻捷电子的发展案例,给半导体产业平台的运营和招商带来了多方面的启示。

1. 半导体创业项目对平台的核心需求:除基础办公场地外,更需要技术研发资源对接、资本对接、下游产业渠道对接等深度服务,早期创业团队很难靠自身搞定全链条资源,依赖平台提供整合服务。

2. 平台可优化的运营方向:可以依托本地高校科研资源打造半导体垂直孵化平台,比如琻捷初期就依托复旦微电子的校友和场地资源搭建了研发平台,平台可以复制这种模式,对接高校资源服务创业项目。

3. 招商与风向规避:招商可以重点偏向有深厚产业经验的回国创业团队,重点布局国产车规芯片替代赛道,引入产业资本共同孵化项目,帮助项目对接下游客户资源;同时要意识到半导体项目研发周期长、不确定性高,需要做好风险分层管理,避免单一项目风险对平台整体带来过大影响。

琻捷电子成功IPO的案例,是国产车规芯片创业的典型样本,对半导体产业研究有较高的参考价值。

1. 产业新动向:当前全球汽车产业链正向中国转移,国内新能源汽车产业的爆发带动了车规芯片的国产替代进程,国内芯片企业已经在多个细分赛道实现突破,诞生了全球领先的企业,产业资本深度参与半导体创业,成为推动国产芯片发展的重要力量。

2. 值得关注的新问题:国产芯片创业赛道选择的问题,不同于多数创业项目追逐热点的路径,琻捷选择避开当时热门的座舱芯片,从相对冷门的TPMS赛道切入,依靠政策预判和技术积累做成龙头,这种差异化路径对研究国产芯片创业策略很有价值。

3. 商业模式总结:该案例形成了“海外资深技术人才回国创业+抓住国产替代与政策红利+细分单点突破+逐步拓展产品线+产业资本持续加持”的国产芯片创业商业模式,为后续研究产业发展规律提供了典型样本。

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Quick Summary

This article covers Kingchip Electronics, an automotive wireless sensing chip startup founded by Li Mengxiong, a PhD in microelectronics and alumnus of Huanggang High School, which held its IPO on the Hong Kong Stock Exchange on June 17. Opening at HK$31.6 per share, the firm commands a market capitalization of nearly HK$15 billion, making it one of the fastest-growing automotive-grade wireless sensing chip companies in China.

1. Core Business and Market Position: Kingchip specializes in wireless sensing system-on-chips (SoCs) with three core product lines: smart cell sensing chips, smart tire pressure sensing chips, and general-purpose smart sensing chips. Based on projected 2025 revenue, it ranks as the world’s third-largest and China’s largest automotive wireless sensing SoC provider, and holds the top global position in the BPS SoC segment.

2. Growth Lessons from Its Startup Journey: With over a decade of automotive chip R&D experience overseas, founder Li Mengxiong recognized the trend of the global automotive supply chain shifting to China, left a stable overseas role to return and launch the business. The company bet on the right track early, spent nearly 20 months overcoming core technical barriers for TPMS chips, successfully capitalized on China’s mandatory installation policy, and grew into the segment leader.

3. Future Growth Drivers: Its fastest-growing product line, smart cell sensing chips, is set for massive expansion amid the coming boom in the wireless BMS market.

Kingchip’s growth from a startup to a segment leader offers valuable insights for brand building and product development for domestic semiconductor companies.

1. Product R&D Strategy: Instead of chasing industry hype, Kingchip selected its market niche based on its own expertise and policy forecasting. It began R&D on TPMS chips long before China introduced mandatory standards, completed mass production certification ahead of the policy rollout, and secured an early market lead. It later expanded into smart cell chips and general-purpose sensing chips aligned with the growth of new energy vehicles and energy storage, building a sequential product pipeline for sustained growth.

2. Channel Development: Kingchip targeted the OEM front-end market from its early days. It now counts all of China’s top 10 automakers among its clients, and has integrated into the supply chain of tier-1 suppliers and OEMs. Its technological advantages have earned it endorsement from industrial capital, further expanding its brand recognition and market reach.

3. Brand Building: Kingchip maintains consistently high R&D investment, with annual R&D spending exceeding RMB 100 million over the past three years. R&D staff account for over 55% of its total workforce, and its gross margin has grown steadily from 16.6% to 28%, building core competitiveness as a technology-driven brand.

Kingchip’s growth story provides clear opportunity signals and actionable lessons for practitioners in the automotive chip sector.

1. High-Growth Market Opportunities: Demand for wireless sensing chips is surging across new energy vehicles, energy storage, industrial robots and other sectors. The global market for wireless BMS chips is projected to jump from RMB 100 million in 2027 to RMB 22.2 billion in 2030, representing extremely rapid growth. Meanwhile, general-purpose sensing chips are expanding into medical devices, drones, smart home appliances and other fields, creating abundant untapped market opportunities.

2. Key Lessons: Companies need to forecast policy trends early to capture policy dividends. Kingchip launched TPMS R&D four years before China’s mandatory standard took effect, completed certification ahead of the policy, and captured major market share immediately after implementation. It is also critical to leverage industrial resources and secure support from industrial capital and downstream clients.

3. Risk Warnings: The chip sector features long R&D cycles and high upfront investment, and automotive-grade chips require particularly long certification periods. Early-stage startups commonly face financing difficulties and R&D setbacks, so teams need to reserve sufficient capital and build a strong team in advance to cope with uncertainty.

Kingchip’s growth points to clear demand directions and business opportunities for domestic automotive electronics and semiconductor manufacturing plants.

1. Product and Manufacturing Requirements: Automotive-grade chips have far stricter manufacturing requirements than consumer chips. For example, TPMS chips must withstand wide temperature ranges from -40°C to 125°C, tolerate centrifugal force from high-speed tire rotation, and feature ultra-low power consumption and ultra-small packaging. This places extremely high demands on manufacturing process precision and reliability testing capabilities. Factories must upgrade their technical capabilities to enter the automotive-grade chip supply chain.

2. Business Opportunities: As domestic automotive-grade wireless sensing chips grow rapidly, product lines have expanded from automotive applications to utility-scale energy storage, commercial heavy trucks, industrial robots, medical devices and many other fields, driving sharp growth in chip orders. Upstream manufacturers can partner with leading domestic chip companies to secure long-term, stable orders.

3. Key Takeaways: The wave of domestic substitution for automotive chips has arrived in China. Manufacturers need to accelerate technological upgrades to meet the production requirements of automotive-grade chips, capture growth opportunities brought by supply chain relocation, and increase their market share.

Kingchip’s startup journey reflects current industry trends and pain points in semiconductor entrepreneurship, offering guidance for relevant service providers.

1. Industry Trends: Domestic substitution for automotive chips is accelerating in China, and a growing number of technical talents with overseas experience are returning to launch startups. Early-stage projects in niche segments such as wireless sensing chips are growing rapidly, driving surging demand for tailored entrepreneurial support services, particularly for services that integrate industrial and capital resources, which remain largely underserved.

2. Core Client Pain Points: Early-stage semiconductor startups generally face difficulties in securing funding, recruiting talent, and accessing industrial resources. Automotive-grade chips have long R&D and certification cycles and require massive investment, so many face the risk of capital shortage during industry downturns. Additionally, startup teams often lack channels to connect with downstream automakers and battery manufacturers, making it difficult to access the front-end OEM market.

3. Actionable Solutions: Service providers can partner with universities and industrial capital to build vertical incubation systems, providing early-stage projects with R&D facilities and technical matching support, as well as sustained capital injection including reserved funding for projects during industry downturns. Providers can also connect startups with downstream industrial resources to help them secure clients quickly and improve overall startup success rates.

Kingchip’s growth case offers multiple insights for the operation and investment sourcing of semiconductor industry platforms.

1. Core Needs of Semiconductor Startups: Beyond basic office space, semiconductor startups need in-depth support for R&D resource matching, capital connection, and downstream channel access. Early-stage teams can rarely build a full value chain on their own, and rely heavily on platforms to provide integrated services.

2. Potential Optimizations for Platform Operations: Platforms can build vertical semiconductor incubation hubs leveraging local university research resources. Kingchip built its initial R&D platform using alumni networks and facilities from Fudan University’s microelectronics department, a model that can be replicated by other platforms to connect academic resources for startups.

3. Investment Sourcing and Risk Mitigation: Platforms can prioritize investment in returning entrepreneurial teams with deep industry experience, focus layout on the domestic automotive chip substitution track, and co-incubate projects with industrial capital to help startups connect with downstream clients. At the same time, platforms must recognize that semiconductor projects have long R&D cycles and high uncertainty, so they need to implement layered risk management to avoid excessive negative impact from any single project on the platform’s overall performance.

Kingchip’s successful IPO serves as a typical case of domestic automotive chip entrepreneurship, offering high reference value for semiconductor industry research.

1. New Industry Trends: The global automotive supply chain is shifting to China, and the boom in China’s new energy vehicle industry has accelerated the domestic substitution of automotive chips. Domestic chipmakers have already achieved breakthroughs in multiple niche segments, giving rise to globally leading enterprises. Industrial capital has become deeply involved in semiconductor entrepreneurship, emerging as a key driving force for the development of domestic chips.

2. New Research Questions: The case highlights the understudied question of niche selection for domestic chip startups. Unlike most startups that chase hot sectors, Kingchip avoided the popular in-cabin chip segment at the time of founding, entered the relatively overlooked TPMS market, and built a leading position through policy forecasting and technical accumulation. This differentiated path offers significant value for research on domestic chip startup strategies.

3. Business Model Summary: The case exemplifies a replicable business model for domestic chip startups: "senior overseas technical talents returning to found the company + capturing domestic substitution and policy dividends + breakthrough in a single niche segment + gradual product line expansion + sustained support from industrial capital", providing a representative sample for future research on China’s semiconductor industry development.

Disclaimer: The "Quick Summary" content is entirely generated by AI. Please exercise discretion when interpreting the information. For issues or corrections, please email run@ebrun.com .

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作者丨 卜松

编辑丨 刘恒涛

刚刚,港股又迎来一家Physical AI端侧感算芯片公司。

6月17日,SENASIC琻捷正式登陆港交所,开盘价31.6港币,市值近150亿。公司主营无线传感SoC,产品目前在智能电芯芯片、智能轮胎芯片、智能通用传感芯片等方向,当下增长最快的业务是智能电芯芯片。

根据招股书披露的数据,SENASIC琻捷在2023年-2025年的公司收入分别为2.235亿元、3.475亿元和4.779亿元,同期毛利率分别为16.6%、20.3%和28.0%,近三年保持了稳定的增长节奏。

按弗若斯特沙利文口径,以2025年收入计,公司是全球第三大汽车无线传感SoC公司,也是中国最大的汽车无线传感SoC公司。而在BPS SoC(电池压力传感芯片)这一细分市场,公司排在全球第一。

据了解,其客户已覆盖中国前十的汽车OEM,并已进入一级供应商和整车厂合作体系。在TPMS(胎压监测芯片)这一条线上,SENASIC琻捷是中国第一家、也是目前唯一一家同时向汽车OEM提供TPMS SoC(传统射频版胎压集成芯片)和BLE TPMS SoC(蓝牙版胎压集成芯片)的供应商。

放弃安稳日子,回国做芯片

SENASIC琻捷成立于2015年,创始人李梦雄在复旦大学和英国诺丁汉大学完成本硕博学业,之后在新加坡和英国从事芯片研发与管理工作多年,长期接触汽车传感芯片业务。

1977年,李梦雄出生于湖北黄梅。他就读的,是曾出现在无数中学生辅导书封面的黄冈中学,这所名校大多是从各县市择优录取出来的尖子生。

李梦雄回忆,一个班50来个同学,最后考进清华、北大、复旦、上海交大等名校的大概能有十五六个。这样的环境,给了他很强的竞争意识。

“我花了很多时间在理科图书馆里看电影,然后花了更多的时间在足球场上。”上世纪90年代考进复旦之后,李梦雄整个人松弛了下来。他很感激复旦校园里的自由气氛,让他有时间寻找自我,思考未来的职业路径。

李梦雄的本科专业是电子工程,在研究生转向了微电子。毕业后,他先是去了全球知名的日本打印机、通信设备和半导体制造商OKI设在?新加坡的技术中心(OTCS)(后被华为收购),做射频芯片、蓝牙、ADC、DAC等模拟技术研究,后来到英国诺丁汉大学攻读博士,期间进入SEQUANS英国分公司,边读书边工作。

2009年,李梦雄加入SENSATA汽车传感芯片事业部,负责汽车无线传感芯片设计与开发,后来带领团队负责了年出货量近亿颗的汽车传感芯片设计、客户导入和量产,终端客户覆盖宝马、奔驰、通用、福特、大众、丰田等整车厂。那时的他,已经在英国雷丁定居多年,工作稳定,生活也很平静。

2014年前后,因为项目管理的关系,李梦雄越来越频繁地往返伦敦希思罗机场和上海浦东国际机场之间。

在这一阶段,他对中国汽车产业的感受开始变得强烈起来。比亚迪、吉利等自主品牌逐步做大,新能源汽车产业链也在快速形成,汽车配套产业链的节奏明显变了。他强烈意识到,

汽车产业链正在向中国转移。

“过去十年,智能手机产业链的发展带动了中国电子产业的空前发展与繁荣,我当时觉得,这个故事大概率会在汽车产业再次上演。”李梦雄说。

那几年,随着《国家集成电路产业发展推进纲要》出台,国内半导体行业迎来新的政策窗口,李梦雄汽车产业的朋友也经常鼓动他回国创业。

2015年3月,SENASIC琻捷在上海成立。

创业初期并不轻松。李梦雄当时最主要的工作,就是“找钱、找人”,除此之外,还要关注项目落地,他自嘲当时的自己“像一个救火队员”。在复旦微电子学院老师和校友的帮助下,团队一度借用了复旦大学张江校区的两间办公室,把最初的研发平台搭了起来。公司的第一款芯片,也正是从那两间办公室里做出来的。

创业第一枪:

啃下TPMS这块硬骨头

很多芯片公司创业时,都会先找一个落地节奏更快的产品。然而,SENASIC琻捷并没有这样选。

公司成立后,李梦雄定下的第一款产品便是TPMS,即胎压监测传感芯片。胎压监测传感芯片负责监控汽车的轮胎压力、胎内温度、运动状态,并将数据通过无线信号发回给车载系统。在当时,美国和欧盟等许多国家与地区,都已经出台法规,强制要求新车出厂必须标配TPMS系统。

在当时,随着特斯拉Madel S的量产,座舱芯片、以三电系统管理为主的功率半导体芯片正在成为行业热点。而胎压监测传感芯片相对没有那么热,尤其是在国内,当时只有推荐性标准、无强制装车,热度就更低了。

而李梦雄确定TPMS为第一款产品,来自他对政策的预测。

2014年,国内胎压强制标准已经“山雨欲来”。欧盟在当年11月正式强制所有新车标配TPMS,使得传感芯片的出货量呈指数级增长。按李梦雄的测算,一旦中国的强制标准落地,每辆车就要用4到5颗TPMS芯片,包括标配轮胎、全尺寸备胎和车载系统的接收端。这是一个肉眼可见的市场机会。

不过,要真正把这颗芯片做出来,花的时间比想象中更长。

首先,由于它在轮胎内部工作,必须能承受-40℃-125℃的温差,以及轮胎高速旋转带来的巨大离心力。其次,它无法接电线,只能靠一颗小纽扣电池供电,要保证一颗电池可以工作5-10年。更关键的是,这枚芯片要把把传感器、处理器和无线电发射器全部浓缩在一个极小的封装内,制造工艺非常复杂。

因此,TPMS的制造难度远超一般的消费级芯片。

李梦雄和团队前后花了近20个月,芯片原型设计花了168天,可靠性测试和认证花了586天,进行了12次底层固件更新。2018年,SENASIC琻捷作为中国首家通过了车规级AEC-Q100认证的企业,量产出首款国产TPMS芯片,并在2019年打入汽车前装市场。

2017年10月14日,GB26149-2017正式发布,这是中国关于“乘用车轮胎气压监测系统的性能要求和实验方法”的强制性国家标准。按照规定,从2020年1月1日起,M1类新车(即9座以下的小客车)强制安装TPMS。

SENASIC琻捷这款产品踩到了点。从招股书看,TPMS至今仍然是公司重要的业务基础。2025年,SENASIC琻捷TPMS SoC销量达到4467万颗,收入约2.91亿元,打入了上汽、广汽等主流车厂供应链。

从轮胎到电芯

产品线逐渐铺开

根据SENASIC琻捷招股书,目前公司已形成三条核心产品线,分别为智能电芯芯片、智能轮胎芯片、智能通用传感芯片。其中,胎压监测传感芯片于2018年实现量产,智能电芯芯片和智能通用传感芯片于2021年相继量产。

其中,智能电芯芯片(BMS)是近年资本市场关注度较高的方向之一,它既能简化储能系统成千上万个电芯的组装工艺,也可为工业机器人省去高达90%的电池内部通信线束,实现极致减重,降低维护成本。

李梦雄表示,公司的BMS产品主要面向电池电芯在高热工况下的故障检测场景,目前已能够完成电压、电流、温度以及电化学阻抗等关键数据采集。基于这些数据,本地算法进一步参与判断,不仅提升对续航水平的估算精度,也可对未来一周乃至一个月内可能出现的穿刺风险和热失控风险进行更早期的预警。

招股书披露,按2025年收入计,SENASIC琻捷在这一细分市场位列全球第一。随着无线BMS(wBMS)在新能源汽车上广泛应用,全球无线BMS芯片的市场规模预计将从2027年的1亿元增长至2030年的222亿元。

除了乘用车市场,无线BMS的应用场景正在向大规模储能、商用重卡、工业机器人及电池回收等领域快速渗透。这也是公司持续推进该产品线的重要原因之一。根据招股书,截至最后实际可行日期,相关产品已进入前端验证阶段,并正在推进中国头部电芯及电池制造商的正式认证。

与此同时,公司的智能通用传感芯片(USI)正广泛落地在汽车车载空调压力、刹车真空助力、超声波泊车雷达上,在工业管道压力变送器、储能辅舱压力监测场景上稳步增长,同时也探索在医疗器械、无人机、智能家电上的可行性。

换言之,SENASIC琻捷最早从轮胎内部的传感芯片切入,如今已逐步储能、汽车、工业电子、机器人等多元高增长场景。

在财务表现上,2023年至2025年,公司营收由2.235亿元增长至4.779亿元;同期研发投入分别为9590万元、1.079亿元和1.015亿元。

在2025年的营收结构中,智能轮胎芯片占比60.9%,为第一大收入来源;智能通用传感芯片占比24%;智能电芯芯片占比14%,同比增速56.6%,在三大业务中增长最快。

截至2025年末,公司研发团队共125人,占员工总数的55%以上。

资本云集,产投持续看好

随着产品量产与商业化落地,SENASIC琻捷逐步获得各路资本青睐,融资节奏稳步推进。

据睿兽分析数据,公司融资历程呈现出鲜明的产业资本加持特征。宁德时代通过晨道资本先后参与C轮、D轮、D+轮三轮融资,上汽集团旗下尚颀资本也两次追加投资;而此次IPO的基石投资者中,同样引入欣旺达、保隆科技等产业资本,体现产业方对公司及赛道的长期看好。

除产业资本外,公司股东阵容还涵盖华登国际、经纬创投、纪源资本等知名VC,以及中芯聚源、国调基金、浦东科创旗下海望资本等。以本次18.36港元的发行价测算,2017年天使轮入局、2018年B轮追加投资的华登国际,账面回报约42-56倍;同期参与天使轮的明照资本,账面回报约28倍。

作为晨道资本持续加码的核心标的,SENASIC琻捷也是宁德时代在BPS SoC领域最重要的国产芯片供应商。

回顾发展历程,2018年前后行业受中美贸易摩擦影响,公司也曾遭遇融资难题,而华登国际给予了关键支持。创始人李梦雄回忆道:“完成当年融资后,华登方面表示,若后续融资遇阻,他们已预留专项资金持续支持公司发展。”

完成IPO后,SENASIC琻捷的成长逻辑将进入实质验证阶段,市场将关注成熟的智能轮胎芯片是否能维持势头、持续提升全球市场份额,以及增长最迅猛的智能电芯业务在新能源赛道的铺货情况。而在智能通用传感芯片未来涉及的工业电子、机器人等中长期布局的新方向,何时能转化为可落地的业绩增量,将直接关系到公司长期成长的天花板。

注:文/卜松,文章来源:创业邦(公众号ID:ichuangyebang ),本文为作者独立观点,不代表亿邦动力立场。

文章来源:创业邦

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