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首日涨幅1212% 重庆国资赚翻了

王满华 2026-06-25 09:21
王满华 2026/06/25 09:21

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本文核心分享了半导体企业臻宝科技登陆科创板的现象级造富事件,核心干货信息整理如下:

1. 上市核心数据:臻宝科技发行价为44.56元/股,首日收盘价585元/股,涨幅达1212.84%,总市值908.45亿元。按照科创板中一签500股计算,投资者最高点卖出可获得超27万元浮盈,是近年少见的“大肉签”。

2. 造富情况:创始人王兵持股约36.01%,上市首日身家超327亿元;早期进入的个人投资者杨璐总投入约1097.5万元,持股市值达55亿元,投资回报超500倍,早期重庆国资投资也获得数百倍回报。

3. 风险提示:目前所有浮盈都属于账面财富,受锁定期限制无法立刻兑现,企业后续还要面对半导体行业周期波动、技术迭代加速的不确定性,普通投资者需注意后续投资风险。

本案例对布局半导体领域的品牌商,有明确的赛道参考干货,整理如下:

1. 产品研发方向参考:早年国内半导体设备核心零部件严重依赖进口,高纯硅、石英等核心材料长期被海外厂商垄断,抓住国产替代的结构性机会切入赛道,就能获得高速增长空间。

2. 核心竞争力打造路径:臻宝科技向上游延伸布局,实现了大直径单晶硅棒等多种核心材料的自主量产,是国内少数掌握上游原材料自主可控能力的厂商,借此拿到了京东方、英特尔等国内外头部客户订单。

3. 行业趋势与风险:当前国产替代需求明确,赛道红利突出,臻宝科技近三年营收从5.06亿元增长至8.46亿元,净利润持续稳健上涨,但行业依然存在周期波动、技术迭代加速的不确定性,需要持续攻坚技术。

本案例给布局半导体赛道的相关从业者,带来了明确的机会参考与风险提示,核心干货整理如下:

1. 赛道增长机会:当前半导体设备核心零部件国产替代是确定性的结构性机会,原本海外垄断的市场空间正在向本土厂商开放,只要突破技术壁垒就能快速获得头部客户认可,市场增长潜力大。

2. 企业发展路径参考:初创企业可以优先对接地方国资获得早期投资,解决初创期资金与落地问题,后续逐步引入产业资本、国家队产业基金,多轮融资后冲刺科创板上市,整套发展路径清晰可参考。

3. 机会与风险提示:当前国产替代窗口已经打开,相关从业者可提前卡位核心赛道,但需要警惕行业周期波动、技术迭代加速的不确定性,需持续投入研发保持竞争力,不要被短期造富效应冲昏头脑。

对于半导体相关制造工厂,本案例可提炼的干货内容整理如下:

1. 产品生产与商业机会:当前国内晶圆厂对本土半导体设备核心零部件需求旺盛,核心硅零部件、石英零部件原本依赖进口,本土工厂只要突破技术实现量产,就能进入京东方、华星光电、英特尔等国内外头部客户的供应链,获得稳定增长的订单。

2. 核心竞争力打造启示:工厂要向上游延伸布局核心原材料,实现核心原材料自主可控,才能构筑技术壁垒,摆脱对海外上游的依赖,臻宝科技正是凭借这一点成为国内唯一同时拿下两大核心零部件品类市占率第一的本土厂商。

3. 发展支持路径:半导体制造工厂可以选择落地有半导体产业扶持政策的地区,对接地方国资获得早期投资支持,解决初创期的资金与资源问题,后续再对接产业资本冲刺上市,实现快速扩张。

针对半导体领域相关服务商,本案例透露的行业干货整理如下:

1. 行业发展趋势:当前半导体装备产业正处于国产替代的关键攻坚期,本土半导体零部件企业正处于高速增长阶段,臻宝科技近三年营收、净利润持续稳健增长,2026年上半年预计营收同比增长超28%,行业整体增长空间大,衍生服务需求多。

2. 核心客户痛点:半导体初创企业多来自外地或技术出身,对落地地区的招商引资政策不熟悉,缺乏落地流程对接经验,同时早期也面临融资难、资源对接难的问题,需求十分明确。

3. 市场机会:服务商可以针对半导体初创企业,提供地方落地对接、融资对接、产业链资源匹配等服务,对接地方政府招商需求和资本方的投资需求,做初创企业从落地到上市全流程的服务,市场空间十分广阔。

对于科创上市平台、产业招商平台来说,本案例可提炼的干货整理如下:

1. 产业端核心需求:半导体科创企业在不同发展阶段,都需要对应平台支持,早期需要产业招商平台对接地方资源与资本,成熟后需要科创上市平台提供融资渠道,帮助企业获得进一步发展的资金,吸引更多产业资源入场。

2. 招商与平台发展方向:平台可以重点引入把握国产替代机会的半导体核心零部件企业,这类企业技术壁垒高、增长速度快,还能带动地方半导体产业链完善,像臻宝科技落地重庆,就成为重庆第一家半导体核心零部件科创板上市企业,战略意义突出。

3. 运营与风险规避:平台需要完善相关规则,充分披露半导体行业的周期波动、技术迭代风险,督促企业做好信息披露,警惕上市后股价大幅波动带来的市场风险,做好上市后的监管与风险提示工作。

对于半导体产业、创投领域的研究者,本案例带来的研究参考干货整理如下:

1. 产业新动向:当前半导体设备核心零部件国产替代已经进入收获期,本土厂商已经突破核心技术壁垒,实现了上游核心原材料的自主可控,头部本土厂商已经拿下两大核心品类市占率第一,进入国内外头部客户供应链,全球半导体产业格局正在发生新的变化。

2. 创投领域新商业模式:当前半导体创投已经形成了清晰的可复制模式,即地方国资提前布局早期优质项目,后续产业资本跟投,国家队产业基金在中后期加注,最终通过科创板上市退出,重庆国资投资臻宝科技获得超高回报就是典型案例。

3. 需要关注的新问题:当前半导体赛道造富效应明显,一级、二级市场估值提升较快,但行业仍然面临周期波动、技术迭代加速的不确定性,需要进一步研究如何平衡短期估值与长期产业发展,更好的支持本土半导体产业攻坚突破。

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Quick Summary

This article centers on the high-profile wealth-generation event when Chinese semiconductor firm Zhenbao Technology's STAR Market IPO, with key takeaways as follows:

1. Core IPO metrics: Zhenbao Technology priced its IPO at 44.56 yuan per share, closing at 585 yuan on its first trading day, marking a 1,212.84% jump from the issue price, pushing its total market capitalization to 90.845 billion yuan. For a standard 500-share IPO allotment on the STAR Market, investors who sold at the day's high would have earned more than 270,000 yuan in unrealized gains — one of the most lucrative IPO allotments for retail investors in recent years.

2. Wealth creation outcomes: Founder Wang Bing holds approximately 36.01% of shares, translating to a net worth exceeding 32.7 billion yuan on the first trading day. Early individual investor Yang Lu invested a total of around 10.975 million yuan, and her stake was worth 5.5 billion yuan after the IPO, representing a return of more than 500x. Early investor Chongqing State-owned Capital also earned a return of several hundred times its initial investment.

3. Risk warning: All current gains are unrealized paper wealth that cannot be immediately cashed out due to share lock-up periods. The company also faces ongoing uncertainty from semiconductor industry cyclicality and accelerating technology iteration, so retail investors should pay close attention to downside risks in subsequent investments.

This case provides clear industry insights for brand owners expanding into the semiconductor sector:

1. Product R&D directional reference: For many years, core components for domestic semiconductor equipment relied heavily on imports, and core materials such as high-purity silicon and quartz were long monopolized by overseas players. Companies that tap into the structural opportunity of domestic substitution can unlock rapid growth.

2. Pathway to building core competitiveness: By extending upstream into its supply chain, Zhenbao Technology has achieved independent mass production of multiple core materials including large-diameter single silicon rods, making it one of the few domestic manufacturers with full independent control over upstream raw materials. This capability has helped it secure orders from leading global and domestic clients including BOE and Intel.

3. Industry trends and risks: Demand for domestic substitution is clear and the sector is enjoying strong structural growth. Zhenbao Technology grew its revenue from 506 million yuan to 846 million yuan over the past three years, with steady net profit growth. However, the industry still faces uncertainty from cyclical fluctuations and accelerating technical iteration, requiring continuous technological breakthroughs.

This case offers clear opportunity insights and risk warnings for industry practitioners targeting the semiconductor track, with key takeaways as follows:

1. Sector growth opportunities: Domestic substitution for core semiconductor equipment components is a well-defined structural opportunity. Market space previously monopolized by overseas players is now opening up to local manufacturers. Companies that break through technical barriers can quickly win recognition from leading clients, with huge growth potential.

2. Reference for corporate development pathways: Startups can prioritize securing early-stage investment from local state-owned capital to solve early-stage funding and localization needs, then gradually bring in industrial capital and national-level industrial funds, before pursuing a STAR Market IPO after multiple rounds of financing. This entire development pathway is clear and replicable.

3. Opportunity and risk reminder: The window for domestic substitution is now open, and relevant practitioners can position themselves early in core market segments. However, they should remain alert to uncertainty from industry cyclicality and accelerating technical iteration, continue investing in R&D to maintain competitiveness, and avoid being carried away by short-term wealth creation hype.

Key takeaways for semiconductor-related manufacturing plants from this case are as follows:

1. Production and business opportunities: Domestic wafer fabs have strong demand for locally produced core semiconductor equipment components. Core silicon and quartz components were previously import-dependent. As long as local plants can master the technology and achieve mass production, they can enter the supply chains of leading global and domestic clients including BOE, CSOT and Intel, and win stable, growing orders.

2. Insights for building core competitiveness: Plants should extend upstream布局 core raw materials and achieve independent control over core inputs to build technical barriers and end reliance on overseas upstream suppliers. This exact strategy allowed Zhenbao Technology to become the only domestic manufacturer to hold the top market share in two core component categories simultaneously.

3. Pathway to growth: Semiconductor manufacturers can choose to locate in regions with strong semiconductor industry support policies, secure early-stage investment from local state-owned capital to solve early-stage funding and resource gaps, then connect with industrial capital and pursue an IPO to achieve rapid expansion.

Key industry takeaways for semiconductor-focused service providers from this case are as follows:

1. Industry development trends: The domestic semiconductor equipment industry is now in a critical phase of domestic substitution advancement, and local semiconductor component manufacturers are entering a period of rapid growth. Zhenbao Technology has delivered steady revenue and net profit growth over the past three years, and expects its revenue to grow by more than 28% year-over-year in the first half of 2026. The overall industry has large growth space, creating strong demand for supporting services.

2. Core pain points of clients: Most semiconductor startups are founded by technology teams or based outside major industry clusters, so they are unfamiliar with local investment attraction policies, lack experience in coordinating the site entry process, and also face common early-stage challenges of difficulty accessing financing and industrial resources — their needs are well-defined.

3. Market opportunities: Service providers can offer tailored services for semiconductor startups covering site entry coordination, financing connection and industrial resource matching. They can bridge the investment attraction needs of local governments and the investment needs of capital providers, and build full-lifecycle services supporting startups from site entry through to IPO, opening up a very broad market space.

For technology IPO platforms and industrial investment attraction platforms, this case offers the following key insights:

1. Core industry-side demand: Semiconductor technology startups need corresponding platform support at different development stages. In the early stage, they rely on industrial investment platforms to connect to local resources and capital. When they mature, they need technology IPO platforms to provide financing channels to secure capital for further growth and attract more industrial resources.

2. Direction for investment attraction and platform development: Platforms should prioritize introducing semiconductor core component companies that are capitalizing on domestic substitution opportunities. These companies have high technical barriers, grow quickly, and can drive the improvement of local semiconductor industrial chains. For example, Zhenbao Technology's establishment in Chongqing made it the first local semiconductor core component company listed on the STAR Market, with outstanding strategic significance.

3. Operation and risk mitigation: Platforms need to improve relevant rules, fully disclose risks of industry cyclicality and technical iteration, require companies to maintain high-quality information disclosure, guard against market risks caused by large post-IPO stock price fluctuations, and strengthen post-listing regulation and risk communication.

This case provides valuable research reference for researchers focusing on the semiconductor industry and venture capital sectors, with key insights as follows:

1. New industry trends: Domestic substitution for core semiconductor equipment components has now entered a phase of commercial realization. Local manufacturers have broken through core technical barriers and achieved independent control over upstream core raw materials. Leading local players have already captured the top market share in two core component categories, entered the supply chains of leading global and domestic clients, and the global semiconductor industry landscape is undergoing new shifts.

2. New replicable venture capital model: Semiconductor venture capital has now formed a clear, replicable model: local state-owned capital makes early investments in high-quality projects, followed by follow-on investments from industrial capital, then national-level industrial funds make late-stage investments before exit via a STAR Market IPO. Chongqing State-owned Capital's extremely high return from its investment in Zhenbao Technology is a representative case study.

3. New issues requiring attention: The semiconductor sector currently has a very strong wealth creation effect, and valuations in both primary and secondary markets have risen rapidly. However, the industry still faces uncertainty from cyclical fluctuations and accelerating technical iteration. Further research is needed on how to balance short-term valuations and long-term industrial development, to better support breakthroughs for the domestic semiconductor industry.

Disclaimer: The "Quick Summary" content is entirely generated by AI. Please exercise discretion when interpreting the information. For issues or corrections, please email run@ebrun.com .

I am a Brand Seller Factory Service Provider Marketplace Seller Researcher Read it again.

早期投资人回报超500倍。

A股市场又迎来一只现象级“大肉签”。

今日,半导体设备零部件供应商“臻宝科技”正式挂牌科创板,开盘即报448元/股,较发行价44.56元/股暴涨905.39%,随后涨幅更是持续扩大,直接秒变十倍股。截至收盘,公司股价报585元/股,涨幅高达1212.84%,最新市值定格在908.45亿元。

按科创板中一签500股计算,投资者若在最高点卖出,最高浮盈超27万元。

当然,相较在二级市场“打新”的散户,更值得关注的还有公司背后的一级市场投资机构们。特别是早期投资方重庆国资,2020年11月,重庆国资曾通过 “重庆科芯”入股了臻宝科技。截至目前,该主体仍持有公司约7.02%的股份,按照今日的收盘价计算,对应市值高达63.78亿元,已经实现了超级回报。

不得不说,半导体的造富效应着实惊人。

重庆跑出一家明星IPO

创始人身家超320亿

臻宝科技的掌舵人,是一位1980年出生的上海人——王兵。

毕业于华东交通大学机电一体化专业的他,早年曾在一家上海玻璃钢公司担任销售工程师,直到2004年才转型至半导体行业,在上海霜融国际贸易有限公司担任半导体设备工程师和销售工程师。

20年前的国内半导体行业,设备核心零部件严重依赖进口,特别是高纯硅、石英等材料制备技术长期被海外厂商垄断。身处一线的王兵敏锐捕捉到了国产替代的结构性机会,于是2016年在重庆成立了臻宝科技,扎根集成电路、显示面板两大领域,专注制造设备真空腔体内工艺反应类核心零部件的研发、生产与配套服务。

根据招股书,公司目前核心业务涵盖了自主原材料、精密零部件和高端表面处理服务三大板块。在上游原材料端,臻宝科技已实现大直径单晶硅棒、多晶硅棒、CVD高纯碳化硅超厚材料及陶瓷造粒粉体等半导体材料的量产,是国内极少数具备上游原材料自主可控能力的零部件厂商。

公司的客户名单堪称豪华,涵盖了京东方、华星光电、晶合集成、华润微电子等国内主流厂商,以及英特尔(大连)、格罗方德、联华电子、德州仪器等国际知名企业。

据弗若斯特沙利文数据,2024年,在国内直接供应晶圆厂的本土零部件企业中,臻宝科技硅零部件和石英零部件的市场份额分别达4.5%和8.8%,双双位列本土企业第一,也是唯一同时拿下两大核心品类市占冠军的国内厂商。

强劲的订单需求直接体现在业绩上。招股书显示,2023年、2024年、2025年,臻宝科技的营收分别为5.06亿元、6.35亿元、8.46亿元,净利润分别为1.08亿元、1.52亿元、2.26亿元,持续稳健增长。此外,公司预计2026年上半年,营业收入达4.72亿至4.92亿元,同比增长28.83%至34.29%。

IPO前,王兵直接持有臻宝科技44.33%的股份,并通过重庆臻芯合伙、重庆臻宝合伙控制该公司12.88%的股份。发行后,该持股比例稀释至约36.01%,按上市首日收盘价计算,其身家已达到327.1亿元。

从2016年重庆一间初创公司,到2026年市值超900亿元的科创板明星,王兵用十年时间完成了从一名销售工程师到300亿身家创业者的跨越。

早期投资人回报超500倍

当然,除了创始人之外,这场财富盛宴的直接受益者,还有那些一路陪伴公司成长的一级市场投资机构们。

早在2020年11月,重庆国资就通过 “重庆科芯”入股了臻宝科技;2022年2月,公司又获得了来自天津显智链与加格咨询的A轮融资;一年之后的2023年3月,公司再次完成B轮融资,资方包括元禾璞华、聚源振芯、华虹虹芯、石溪舜创等。

臻宝科技的最后一轮发生在2023年12月。当时这笔Pre-IPO轮的资方,涵盖了集成电路二期基金、长存基金、中证投资、上海浦宸、重庆渝富、半导体二期、苏州厚望及闻芯投资等多家国家队资金及地方基金。

据了解,公司最后一轮融资的投后估值约26.65亿元,而按上市首日收盘价计算,这轮进场的投资人账面浮盈就已超过30倍。

当然,收获最丰的还属重庆国资。

根据招股书,IPO前,早期投资人重庆科芯仍持有9.36%的股份,是公司的第三大股东。发行后,该持股比例稀释至约7.02%,对应市值约为63.78亿元;另一重庆国资,也就是重庆渝富资本,上市后则持有0.28%的股份,对应市值约为2.54亿元。

而除了财务层面的回报,臻宝科技对重庆而言还承载着不可忽视的战略意义——它不仅是重庆第一家登陆科创板、且主营半导体设备核心零部件的上市企业,同时也是重庆2026年第二家A股新股。

至于其他股东。招股书显示,发行后,天津显智链持股比例为3.38%,国家集成电路二期基金持股2.95%,长存基金持股1.69%,元禾璞华与聚源振芯分别持股1.38%。

另值得一提,除了机构投资者之外,还有一名个人投资者格外引人瞩目,那就是公司的第四大股东——杨璐。根据招股书,其曾于2016年3月至2017年10月间,在华夏银行重庆高新支行任副行长一职。

杨璐与创始人王兵渊源颇深——其配偶是王的大学同学,因在重庆当地银行的工作经历,杨璐深谙当地的招商引资政策、了解企业投资落地流程,因此在公司创业初期提供了不少协助。

也正是因为这层关系,在2019年11月时,杨璐曾以1元/股的价格认缴增资787.50万元;2020年10月,又以2元/份的价格通过员工持股平台入股,认缴155万份,共计出资1097.5万元。

根据招股书,上市后,杨璐直接持股5.07%,间接持股0.9975%,合计持股6.0675%。按照收盘价计算,杨璐的持股市值为55亿,翻了502倍。

当然,由于锁定期限制,上述还都是“账面富贵”。而且股价的狂欢之后,臻宝科技与背后股东仍需面对半导体行业周期波动、技术迭代加速等不确定性。正如王兵在上市仪式上所说:“半导体装备产业正处在关键攻坚期”。

上市,只是这家公司新的起点。

注:文/王满华,文章来源:投中网(公众号ID:China-Venture),本文为作者独立观点,不代表亿邦动力立场。

文章来源:投中网

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