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腾讯重仓 上海千亿IPO要来了

刘博 2026-05-12 13:27
刘博 2026/05/12 13:27

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本文核心是国内头部大模型厂商阶跃星辰完成25亿美元约合170亿元新融资,正冲刺千亿级赴港IPO,透露出当前中国AI产业的最新动向,核心干货信息如下

1. 融资与IPO进展:阶跃星辰年内累计融资超200亿元,老股东腾讯三度跟投,港投公司、华勤技术、龙旗科技、中兴通讯等知名机构和产业巨头参投,目前已经拆除红筹架构,扫清IPO障碍,有望成为国产大模型第三股

2. 行业发展趋势:AI产业已从拼参数的云端大模型时代进入Agentic智能体时代,大模型能力下沉到各类终端成为全球行业共识,OpenAI也在推进自研AI Agent手机研发

3. 阶跃核心竞争力:阶跃是国内少有的原生全模态大模型厂商,多款模型性能位居全球或国内前列,已经在手机、汽车终端跑通商业闭环,手机端模型装机量超4200万台

本文透露出AI时代消费电子行业的新趋势,对品牌布局AI升级、拓展增长空间有诸多参考价值,核心干货如下

1. 消费趋势变化:当前智能手机硬件创新触及天花板,行业进入存量竞争,利润空间不断压缩,AI大模型赋能终端已经成为必然方向,所有智能硬件品类都将面临重新洗牌,AI升级是品牌破局同质化竞争的核心机会

2. 可行合作路径:品牌不需要完全从零自研大模型,可以通过和头部大模型厂商深度绑定,优先获得先进AI能力集成到自身产品中,实现产品价值升级,目前国内60%头部手机品牌已经完成相关布局,验证了路径可行性

3. 生态布局参考:腾讯采用自研大模型+投资拥抱顶尖开源模型的双轨策略,依托自身流量生态优势补齐大模型能力短板,打通变现闭环,这种模式对品牌布局AI有较强的借鉴意义

本文明确了AI+终端是新的增长赛道,给硬件卖家指明了新的机会方向,核心干货如下

1. 增长市场机会:当前大模型向终端迁移已经成为全球AI产业的共识,所有智能终端品类都将被AI重新定义,存量竞争的硬件市场中,AI给卖家带来了全新的增长引擎,市场空间广阔

2. 落地实操路径:卖家不需要投入巨额资金自研大模型,可以通过深度绑定头部大模型厂商,优先获得成熟的先进AI能力,快速集成到自身产品中,实现产品AI升级,打开新的利润空间,中兴和阶跃合作量产AI手机功能就是成功案例

3. 风险与机会提示:当前AI终端赛道的竞争已经加速,头部玩家已经率先卡位核心入口,跑通商业闭环,卖家需要抓住窗口加快布局,否则容易错失这一轮产业升级机会

本文给消费电子制造工厂指明了转型方向和新的商业机会,核心干货如下

1. 产品生产设计需求变化:当前智能手机行业进入存量竞争,硬件创新触顶,下游客户对产品AI能力的需求快速提升,传统工厂的生产设计方案已经无法满足市场需求,需要适配AI终端的新要求

2. 商业转型机会:工厂可以通过投资或深度绑定头部大模型厂商,优先获得成熟AI能力,将AI能力集成到自身的设计制造方案中,摆脱单纯“组装厂”的定位,实现产品价值升级,提升自身利润空间

3. 数字化转型启示:AI大模型下沉终端是不可逆转的产业趋势,工厂本身拥有海量终端制造和出货能力,可以依托自身优势和大模型厂商合作,打通从模型到终端再到用户的完整通路,共同开辟AI终端新市场,实现向AI赋能高端制造的转型

本文透露出AI产业新阶段的行业趋势和客户需求,给AI相关服务商指明了新的发展方向,核心干货如下

1. 行业发展新趋势:当前AI产业已经从早期拼参数、比榜单的云端大模型竞争,进入到Agentic智能体时代,大模型向终端落地成为全球共识,全模态能力是智能体基座的必要条件,产业端对AI落地终端的配套服务需求快速增长

2. 核心客户痛点:当前消费电子供应链企业普遍面临存量竞争、利润空间压缩的痛点,迫切需要AI能力实现产品升级,打开新增长空间;互联网巨头也存在大模型能力补齐、生态变现闭环打通的需求

3. 解决方案机会:服务商可以围绕AI端侧推理效率优化、模型与硬件传感器及通信模块适配、大模型终端落地赋能等方向开发解决方案,满足当前产业端的落地需求,市场空间广阔

AI+终端的产业新趋势给各类科创平台、投资平台带来了新的布局方向,核心干货如下

1. 产业端对平台的核心需求:当前大模型厂商拥有技术能力但缺乏产业落地资源,产业端拥有制造出货能力但缺乏AI技术,平台可以发挥资源对接作用,连接双方打通落地通路,获得自身发展机会

2. 平台招商布局方向:AI+终端是当前稀缺的高增长赛道,拥有原生全模态布局、已经率先跑通终端商业闭环的大模型厂商是优质标的,这类项目获得了互联网巨头、产业资本、政府背景资本的共同认可,增长潜力大

3. 风向规避参考:当前大模型竞争核心已经从拼参数转向拼落地速度,平台布局要避开仅停留在技术层面没有落地场景的项目,重点关注已经打通落地通路、具备不可复制资源优势的项目,港投公司布局阶跃的案例也给政府背景平台布局科创提供了风向标参考

本文展现了国内AI大模型产业的最新发展动向,对研究AI产业发展规律、格局变化有较高的参考价值,核心干货如下

1. 产业发展新动向:国内大模型产业已经进入分水岭阶段,竞争核心从早期拼参数、比榜单转向拼场景落地、卡位产业入口,大模型向终端迁移成为全球共识,AI产业正式进入Agentic智能体时代,全模态大模型成为行业刚需

2. 新的产业合作与投资模式:不同于互联网巨头全自研大模型的传统模式,当前出现了互联网巨头“自研+投资生态协同”的双轨模式,也出现了手机供应链产业资本集体投资大模型厂商、绑定AI能力抢占终端话语权的新投资模式,阶跃融资就是典型案例

3. 产业格局新变化:当前头部大模型厂商已经率先卡位AI终端入口,形成了“模型-终端-用户”难以复制的完整通路,国产大模型即将迎来IPO新阶段,千亿级项目的诞生将进一步推动国内AI产业的竞争格局重塑

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Quick Summary

This article highlights the latest development in China's AI industry: leading domestic large language model (LLM) developer StepFun has secured $2.5 billion (approximately 17 billion RMB) in new funding, and is on track to pursue a $100 billion valuation IPO on the Hong Kong Stock Exchange. Key takeaways are as follows:

1. Financing and IPO progress: StepFun has raised over 20 billion RMB in total this year, with repeated follow-on investment from long-time shareholder Tencent. Other notable investors include Hong Kong Investment Corporation, Huqin Technology, Longcheer Technology, ZTE, among other leading institutional and industrial players. StepFun has already dismantled its red-chip structure to clear regulatory hurdles for IPO, positioning it to become the third publicly traded domestic LLM developer.

2. Industry development trend: The AI industry has shifted from an era of competing on cloud LLM parameter counts to the age of agentic AI. It has become a global industry consensus that LLM capabilities will become increasingly integrated into edge devices. Even OpenAI is developing its own AI Agent-powered smartphone in-house.

3. StepFun's core competitiveness: StepFun is one of the few domestic developers of native full-modal LLMs, with multiple models ranking among the top globally and domestically. It has already built a viable commercial closed loop for mobile and automotive devices, with its mobile model installed on over 42 million devices.

This article outlines new trends in the consumer electronics industry amid the AI era, offering actionable insights for brands looking to implement AI upgrades and unlock new growth. Key takeaways are as follows:

1. Shifting consumer trends: Hardware innovation for smartphones has hit a plateau, leaving the industry trapped in cutthroat competition in a saturated market with steadily shrinking profit margins. AI integration for end devices has become an inevitable industry direction. All smart hardware categories are set to be reshuffled, and AI upgrades represent the core opportunity for brands to break out of homogenized competition.

2. A viable partnership path: Brands do not need to build LLMs entirely from scratch. By forming deep partnerships with leading LLM developers, brands can gain early access to cutting-edge AI capabilities to integrate into their own products and deliver upgraded value. Currently, 60% of China's top smartphone brands have already completed relevant deployments, proving the feasibility of this path.

3. A reference for ecosystem strategy: Tencent has adopted a dual-track strategy of developing in-house LLMs while investing in leading open-source models, leveraging its existing traffic ecosystem to offset LLM capability gaps and close the monetization loop. This model offers strong practical reference for brands building out their AI strategies.

This article confirms that AI-enabled end devices represent a new high-growth track, pointing out clear new opportunity directions for hardware sellers. Key takeaways are as follows:

1. New market growth opportunities: LLM integration into edge devices has become a global industry consensus, and all smart hardware categories will be redefined by AI. In today's saturated hardware market, AI offers sellers an entirely new growth engine with enormous untapped market potential.

2. A practical implementation path: Sellers do not need to invest heavily to build LLMs in-house. By partnering closely with leading LLM developers, sellers can gain early access to mature, cutting-edge AI capabilities, quickly integrate them into their products to deliver AI-powered upgrades, and unlock new higher profit margins. The mass production of AI features in ZTE's partnership with StepFun serves as a successful case study for this model.

3. Opportunity and risk warning: Competition in the AI end device track is accelerating, and leading players have already secured early positions at core entry points and built viable commercial closed loops. Sellers must move quickly to capitalize on this window of opportunity; otherwise, they risk missing out on this round of industrial upgrading.

This article outlines new transformation directions and business opportunities for consumer electronics manufacturing factories. Key takeaways are as follows:

1. Shifting product design and manufacturing requirements: The smartphone industry has entered a saturated, stagnant growth phase, with hardware innovation hitting a ceiling. Downstream clients are seeing rapidly rising demand for AI-enabled product capabilities, and traditional factories' existing product design and manufacturing frameworks can no longer meet new market requirements, requiring adaptation for the AI end device era.

2. Opportunities for business transformation: Factories can gain early access to mature AI capabilities by either investing in or forming deep partnerships with leading LLM developers, then integrate these capabilities into their own design and manufacturing solutions. This allows factories to move beyond the low-margin "assembly-only" positioning, deliver upgraded product value, and expand profit margins.

3. Insights for digital transformation: The migration of LLMs to edge devices is an irreversible industry trend. Factories already hold massive advantages in terminal manufacturing and shipping volume; by leveraging these strengths to partner with LLM developers, they can connect the full value chain from model development to end devices and end users, co-develop the new AI end device market, and complete a transformation into AI-enabled high-end manufacturing.

This article lays out new industry trends and client demand in the new phase of the AI industry, pointing out new development directions for AI-related service providers. Key takeaways are as follows:

1. New industry development trends: The AI industry has moved past its early phase of competing on parameter counts and benchmark rankings for cloud LLMs, and has now entered the age of agentic AI. LLM integration into edge devices is a global industry consensus, and full-modal capability is a necessary foundation for agentic AI systems. Demand for supporting services to bring AI to end devices is growing rapidly across the industry.

2. Core pain points of key clients: Consumer electronics supply chain companies are broadly facing the pain points of saturated market competition and shrinking profit margins, and urgently need AI capabilities to upgrade their products and unlock new growth; large internet companies also have demand to fill gaps in their LLM capabilities and close the loop on ecosystem monetization.

3. New solution opportunities: Service providers can develop solutions focused on on-device AI inference efficiency optimization, model adaptation for hardware sensors and communication modules, and end-to-end enablement for LLM deployment on edge devices to meet current industry implementation demand, representing a massive untapped market.

The emerging trend of AI-integrated end devices has brought new layout opportunities for technology and investment platforms. Key takeaways are as follows:

1. Core industry demand for platforms: LLM developers hold core technical capabilities but lack industry implementation resources, while industry players hold manufacturing and shipping capabilities but lack AI technical expertise. Platforms can leverage their positioning to connect both parties, open up implementation pathways, and capture new growth opportunities for themselves.

2. Investment and sourcing directions for platforms: AI-integrated end devices is currently a rare high-growth track. LLM developers with native full-modal capabilities that have already built out viable commercial closed loops on edge devices represent high-quality investment targets. These projects have secured backing from internet giants, industrial capital, and government-backed capital alike, and hold enormous growth potential.

3. Guidance for risk mitigation: The core of competition in the LLM industry has shifted from competing on parameters to competing on implementation speed. Platforms should avoid projects that only remain at the technical stage without actual落地场景, and focus on projects that have already connected full implementation pathways and hold unreplicable resource advantages. Hong Kong Investment Corporation's investment in StepFun serves as a clear reference for government-backed technology investment platforms.

This article presents the latest developments in China's domestic LLM industry, offering high reference value for research on industry development patterns and landscape shifts. Key takeaways are as follows:

1. New industry development trends: China's LLM industry has entered a watershed stage. The core of competition has shifted from parameter counts and benchmark rankings to scene implementation and卡位 of core industry entry points, with LLM migration to edge devices becoming a global consensus. The AI industry has officially entered the age of agentic AI, and full-modal LLMs have become an industry necessity.

2. New industrial cooperation and investment models: Unlike the traditional model of large internet groups building full in-house LLMs, a new dual-track "in-house R&D + investment ecosystem synergy" model has emerged for internet giants. We have also seen a new investment model where mobile supply chain industrial capital collectively invests in LLM developers and ties up AI capabilities to claim话语权 in the end device market, with StepFun's financing round as a典型案例.

3. New shifts in industry landscape: Leading domestic LLM developers have already secured early positions at the entry point of AI end devices, building an unreplicable full "model - end device - user" value chain. Domestic LLMs are about to enter a new phase of public listings, and the emergence of billion-dollar valuation projects will further reshape the competitive landscape of China's AI industry.

Disclaimer: The "Quick Summary" content is entirely generated by AI. Please exercise discretion when interpreting the information. For issues or corrections, please email run@ebrun.com .

I am a Brand Seller Factory Service Provider Marketplace Seller Researcher Read it again.

一笔创纪录融资要诞生了。

投资界获悉,阶跃星辰即将完成25亿美元(约合人民币170亿元)新融资,投资方阵容中浮现一支产业天团——囊括了华勤技术、龙旗科技、豪威集团、中兴通讯等。

另外,知情人士对投资界透露,老股东腾讯再度跟投本轮融资,香港投资管理有限公司(简称“港投公司”)同样参投。

与此同时,阶跃正加速冲刺IPO。知情人士称,阶跃红筹架构亦已拆除,扫清了赴港IPO的关键障碍。粗略算下来,阶跃今年短短几个月就融资超200亿元,按照这个融资规模和融资速度,创投圈很可能即将诞生下一个千亿级IPO。

透过这笔融资,中国大模型火爆景象尽收眼底:月之暗面、DeepSeek纷纷传出融资大动作。悄然间,中国AI的终局战事打响。

年度IPO要来了,腾讯押注,港投护航

这已是腾讯第三次出手阶跃。

时间线向前推移,早在阶跃B轮融资时,腾讯就已位列投资方阵容之中;后在今年1月那笔令人印象深刻的50亿元B+轮融资中,腾讯作为老股东继续跟投。此番腾讯再度跟投,隐隐透露出一个关键信号——标志着双方之间已从简单的财务投资关系,深化为在AI技术、生态、场景的全面协同。

众所周知,放眼通用大模型领域,字节跳动、阿里巴巴等互联网巨头完全聚焦于自研,这也就有了豆包、千问的诞生。而腾讯则有些不同,所采取的是“自研混元+拥抱顶尖开源模型”的双轨策略。相比之下,腾讯在内容和应用生态方面优势明显。

进一步来看,腾讯需要将存量流量与内容和服务生态高效下沉到终端,构建新的闭环变现模式,因此寻找一个能提供高质量模型的同行者至关重要。而阶跃在基座模型和软硬一体化方案上的丰富积累,恰好能够填补这一空白。

于腾讯而言,多轮持续下注阶跃,早已超出了财务投资的范畴,实际是补齐其基模版图、抢占AI终端入口的关键一步。

正如不久前,腾讯云与阶跃达成战略合作,联动腾讯音乐、视频、地图等内容服务生态,共同打造智能座舱Agent。此外,还将整合阶跃大模型的多意图识别能力与腾讯在支付、地图、出行服务等领域的生态接口,打造车内从需求识别到交易完成的一站式服务闭环。

毋庸置疑,腾讯坐拥国内最庞大的内容与应用生态,如若在微信、QQ等一系列超级APP中,能够将阶跃的模型能力嵌入其中,意味着后者模型训练将获得取之不尽用之不竭的“燃料”。而阶跃也可借助腾讯云,拓展企业服务场景,实现在B端的快速落地。

梳理本轮投资方阵容中,港投公司的出现同样耐人寻味。作为香港特区政府全资拥有的投资主体,港投公司被外界称作“港版淡马锡”。可以看到,在思谋科技、百图生科、银河通用、康诺思腾、英矽智能等外界熟知的科技公司背后,都浮现着港投公司的身影。

港投公司行政总裁陈家齐曾向投资界聊起,团队肩负着双重使命:在追求中长期合理财务回报的同时,更重要的是,通过支持香港创科、策略性产业的发展,提升香港长远的竞争力和经济活力。因此,港投公司的投资决策,往往带有极强的政策导向和风向标意义。

目前阶跃是港投公司唯一投资的通用大模型公司,这一选择绝非偶然。如此不禁让人联想到,阶跃已于今年4月完成股改,变更为股份有限公司;如今,其红筹架构亦已拆除,这通常被视为赴港IPO的前置步骤。

可以预见,“国产大模型第三股”正呼之欲出。

创纪录融资背后,手机供应链巨头云集

这一次,手机供应链巨头们也集体站到阶跃身后。

毫无疑问,这是一笔产业资本浓度极高的融资,细数被曝出的投资方名单——包含华勤技术、龙旗科技、豪威集团、中兴通讯等。同时聚齐一众手机及消费电子产业链龙头企业,这在以往以财务机构、互联网资本为主导的大模型融资中并不多见。

具体来看,华勤技术作为全球最大的手机ODM厂商之一,常年是三星、小米、OPPO、VIVO等头部品牌核心供应商,智能产品出货超过3亿部;

龙旗科技同样是国内ODM行业领军者,覆盖手机、平板、IoT设备等全品类硬件,资料显示其2024年消费电子整体ODM出货量位居全球第二;

豪威集团则是全球头部图像传感器供应商,不仅是手机影像系统关键部件的核心玩家,汽车CIS市占率也位列全球首位;

中兴通讯作为家喻户晓的综合通信制造商,深耕于5G终端、智能硬件领域,今年一季度营收近350亿元,比肩诺基亚和爱立信两大海外巨头。

那么,产业龙头们为何要共同押注一家大模型公司?

当前,随着智能手机换机周期拉长、硬件创新触达天花板,整个市场进入存量竞争,利润空间也被不断压缩。因此,这些产业龙头迫切需要找到新的增长引擎,而AI无疑提供了一个新的可能性。

如此一来,它们集体投资阶跃的逻辑不言而喻——抢占AI终端话语权。试想,当大模型能力下沉至手机、PC、IoT设备等硬件场景中,智能终端将从“被动响应”进化为“主动服务”,每个品类都会迎来一次重新洗牌的机会。

通过与阶跃深度绑定,这些产业龙头可以优先获得先进的模型能力,将其集成进自己的设计制造方案中,从而打破“组装厂”这一标签,实现产品的价值升级。例如,中兴手机此前已与阶跃深度共创AI手机功能,并在努比亚Z80 Ultra等多款旗舰机型量产落地。

对于阶跃,这笔融资的价值远不止资金层面。如果说,过去几年国产大模型的竞争主题是“拼参数、比榜单”;如今真正的胜负手则在于,谁能更快地将模型能力落地具体场景、卡位产业入口。

而手机供应链巨头的集体入场,直接为阶跃打通了大模型落地硬件场景的最后一公里。同时,肉眼可见的每年数亿台智能终端制造与集成能力,也为阶跃打开了一个巨大的AI终端市场想象空间。

比如依托华勤、龙旗的海量终端出货渠道,阶跃的大模型可快速渗透至数亿台智能终端;而借助豪威、中兴的硬件技术优势,可实现模型与传感器、通信模块的深度适配,优化端侧推理效率、降低能耗。

这意味着,阶跃通过这笔融资,可以获得一条“模型-终端-用户”的快速通路,这是其它大模型企业所难以复制的一点。

换言之,阶跃已将通往AI终端时代的门票握在了手中。

中国AI风向标一幕

分水岭正在到来。

时至今日,AI产业已从云端大模型时代,进入到Agentic智能体时代,大模型能力向终端迁移成为全球共识。毫不夸张地说,无论是手机、PC、汽车,还是耳机、眼镜、机器人,都可以作为核心载体被AI重新定义。这也是为何OpenAI在最近被曝出,正加快推进首款AI Agent手机研发进程,最快将于2027年上半年实现量产。

将目光再拉回至国内——在这场新的竞赛之中,为何会是阶跃脱颖而出?

说起来,Agentic时代的核心在于从“被动回应”转向“主动规划、工具调用、环境交互与长期执行”。这意味着,在Agentic时代,全模态能力不是锦上添花,而是必要条件。未来大模型不再是单一对话系统,而是需要成为具备自主性、适应性与执行力的智能体基座。

阶跃是国内极少数投入文本、语音、图像、视觉全模态研发,且坚持原生多模态的模型厂商,这种布局让其拥有贯穿Agent“感知、推理、执行”的闭环能力,能为下一代智能体打造出最适配的底座大模型。

其中,今年2月发布的Step 3.5 Flash,是一款专为Agent场景设计的开源旗舰模型,可以作为Agent大脑执行复杂推理任务。其推理速度最高350 TPS,在Agent场景和数学任务上媲美闭源模型,可以胜任复杂、长链条任务。该模型发布后,连续登顶OpenRouterOpenClaw应用调用量月榜、Trending榜、总调用周榜全球第一。

另外,阶跃也是国内极少数布局全模态模型,并且性能全面领先的公司,自研矩阵覆盖语音交互、实时语音、音频推理、音乐生成、视觉理解及生成、VLA等各个细分领域;近期阶跃新一代语音生成模型StepAudio2.5 TTS在全球知名TTS评测榜单Artificial Analysis Speech Arena Leaderboard位列中国大模型第一。全模态布局,意味着阶跃的模型能覆盖“会看、会想、会做”三大能力,让Agent在智能驾驶、智能座舱、机器人等真实物理世界交互的场景下,顺利执行任务。

在汽车和手机这两个最渗透率最高、最高频的物理终端入口,阶跃已经率先跑通了商业闭环。一组数据显示,在手机领域,国内60% 头部手机品牌已与阶跃达成深度合作,覆盖多个品牌的旗舰机型,模型装机量超过4200万台,日均服务近2000万人次。

纵观国产大模型独角兽中,真正将“AI+终端”作为核心战略、并已形成头部效应的,大概只有阶跃。机会稍纵即逝,当投资人蜂拥而至争抢“AI+终端”的入场券时,阶跃的这种稀缺性,无疑成为无法绕过的选择,某种程度上它就是那个“必投标的”。

至于这是否是正确选项,时间终会给出答案。

注:文/刘博,文章来源:投资界(公众号ID:pedaily2012),本文为作者独立观点,不代表亿邦动力立场。

文章来源:投资界

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